Advisory hotline: 4008-557-528
| PCB source temperature | ≤100℃ |
| CPU temperature | ≤80℃ |
|
DCDC output |
Thermal conductivity:10W/(m*K) Power:5W |
|
CPU chipset |
Thermal conductivity:10W/(m*k) Power:10W |
|
PCB MST |
Thermal conductivity:15W/(m*K) Power:5W |
|
CPU PCB |
Thermal conductivity:15W/(m*K) Power:4W |
|
CPU heat sink |
Dimensions: 125*95*6mm, base plate thickness:2mm, fin count: 10pcs, thickness: 0.6mm；Thermal conductivity: AL-extru. 180W/(m*K) |
|
CU block |
Dimensions:41*41*4.7, Thermal conductivity:385 W/(m*k) |
|
Thermal grease |
Thickness: 0.3mm，Thermal conductivity:3.5W/(m*K) |
|
Soldering approach |
Solder paste 4258，Thermal conductivity:48W/(m*k) 0.2mm |
|
Front side of the grille |
Dimensions:170*27mm; Open area ratio:0.5 |
|
Right side of the grille |
Dimensions:35*30 mm; Open area ratio:0.6 |
|
Back side of the grille |
Dimensions:30*30 mm; Open area ratio::0.7 |
|
fan |
Dimensions:30*30*10 mm |
|
Top side of mainboard |
Dimensions:140*170mm; Thermal conductivity:10W/(m*k); Power:3W |
|
Back side of heat source |
0.8W/pcs |
|
Front side of heat source |
Left row:0.8W/pcs; right row: 1.2W/pcs; |
|
Heat sink |
Dimensions:140*170*4.5mm; Base plate thickness: 2mm; Fin height:2.5mm, |
|
Thermal grease |
Thickness: 0.3mm; Thermal conductivity:3.5W/(m*K) |
|
ottom side of mainboard |
Dimensions:140*170mm; Thermal conductivity:10W/(m*k); Power:3W。 |
|
Source of inverse |
功率：1.5W/pcs |
|
Heat sink |
Dimensions:140*170*4.5mm; Base plate thickness: 2mm; Fin height:2.5mm， |
|
Thermal grease |
Thickness: 0.3mm; Thermal conductivity:3.5W/(m*K) |
(1) Add an30*10mm axial fan to increase the air flow through RX module;
(2) Modify the copper fins in front of the fan in order to increase system air flow.
|
Copper fins |
Dimensions:30*12*0.3mm; Inclination: 1.0; Quantity: 30pcs |
|
Material:C1100; Thermal conductivity:385W/(m*K)。 |
|
|
Heat pipe |
D6 heat pipe thickness: 3mm with the pressed-tube technique; Heat pipe type: Powder sintered; |
|
Add a 30*10mm axial fan; the open area ratio of the new fan inlet is 0.7. |
|
|
Baffle |
Dimensions:160*33*0.5mm; Material: SUS |
|
NO. |
Maximum temperature |
NO. |
Maximum temperature |
NO. |
Maximum temperature |
|
Source 1 |
59.43 |
Source 1.7 |
59.73 |
Source 3.1 |
59.59 |
|
Source 1.1 |
59.54 |
Source 2 |
60.02 |
Source 3.2 |
59.7 |
|
Source 1.2 |
59.66 |
Source 2.1 |
60.19 |
Source 3.3 |
59.77 |
|
Source 1.3 |
59.73 |
Source 2.2 |
60.16 |
Source 3.4 |
59.8 |
|
Source 1.4 |
59.76 |
Source 2.3 |
59.96 |
Source 3.5 |
59.8 |
|
Source 1.5 |
59.77 |
Source 2.4 |
59.76 |
Source 3.6 |
59.78 |
|
Source 1.6 |
59.76 |
Source 3 |
59.48 |
Source 3.7 |
59.74 |
|
NO. |
Maximum |
NO. |
Maximum |
|
Source 4 |
60.83 |
Source 4.4 |
60.95 |
|
Source 4.1 |
60.53 |
Source 4.5 |
60.89 |
|
Source 4.2 |
60.92 |
Source 4.6 |
60.8 |
|
Source 4.3 |
60.96 |
Source 4.7 |
60.67 |
Fan operating point:
Air flow through fan grilles:
|
|
CPU maximum temperature |
Temperature range of the heat source |
System air flow |
|
Simulation results of the solution |
64.43 |
60.92~59.43 |
8.4 |
|
The results meet the requirements of CPUtemperature less than℃and heat source temperature less than 100℃ and the thermal design is complete. |
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Winshare Thermal Ltd. (hereinafter referred to as Winshare Thermal) was founded in 2009. We specialize in the research and development, production and technical services of high power cooling solutions. We are devoted to becoming the leader in the thermal... [See details]
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